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Scope

(1) SMD type zinc oxide based ceramic chip

(2) Lead free plating termination provided good solderability characteristic

(3) Insulator over coat keeps excellent low and stable leakage current

(4) Quick response time (<1ns)

(5) Low clamping voltage

(6) High transient current capability

(7) Meet IEC 61000-4-2 level 4 standard

(8) Compact size for EIA 0603

Applications

Applications for Mother Board and Notebook, Cellular Phone, PDA, handheld device,

DSC, DV, Scanner, and Set-Top Box etc.

Suitable for Push-Button, Power Line and Low Frequency single line over voltage protect.

Scope

(1) SMD type zinc oxide based ceramic chip

(2) Lead free plating termination provided good solderability characteristic

(3) Insulator over coat keeps excellent low and stable leakage current

(4) Quick response time (<1ns)

(5) Low clamping voltage

(6) High transient current capability

(7) Meet IEC 61000-4-2 level 4 standard

(8) Compact size for EIA 0402

Applications

Applications for Mother Board and Notebook, Cellular Phone, PDA, handheld device,

DSC, DV, Scanner, and Set-Top Box etc.

Suitable for Push-Button, Power Line and Low Frequency single line over voltage protect.